Circuit Board Manufacturing & PCB Assembly & Electronic Assembly service & electronics manufacturing company – Hitech Circuits Co., Limited
As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective and express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and PCBA testing services for our customers.
For full turn-key circuit board assembly, we take care of the entire process, including Printed Circuit Boards fabrication, components sourcing, order tracking, continuous monitoring of quality and final PCB board assembly. Whereas for partial turn-key, the customer can provide the PCBs and certain components, and the remaining parts will be handled by us.
After the PCB manufacturing process, where the board structure is completely finalized, the PCB assembly process occurs. During PCB manufacturing, the holes have been pierced to create spaces with specific dimensions for the attachment of designed electric components. Several actions sequentially happen during the assembly phase, with the final aim to enable firm and permanent fixture of the electronic components to the board.
The first stage of the PCB assembly process is applying the solder paste onto the PCB surface. The primary goal is to fill the holes with the appropriate amount of solder paste so that electrical components can be attached later. The solder layer must end up in apertures, while the flat PCB surface should remain intact. Therefore, applying a highly selective technique is mandatory to fill holes of various sizes with appropriate film thickness. One of the most widely used techniques is solder paste printing, representing a standardly used technique in our production plant.
Stencil preparation
The metal sheet should cover the entire surface of the print circuit board except for the holes filled with the solder paste later on. Therefore, the metal sheet must be processed to follow the PCB pattern defined by industrial design, where apertures within the sheet have the same shape, width, and length as their pair holes at the PCB. This metal sheet is widely called a stencil, made of whether brass or stainless steel.
The stencil design is a highly challenging task since the precision of the stencil's shape and uniformity of stencil thickness are essential for accurate and purposeful PCB assembly. The typical thickness range of a stencil is between 0.0254mm and 0.762mm. The metal sheet thickness is a parameter that depends on the types of electric components used in the particular PCB, and it is determined separately for each printed circuit board. Even the slightest under or oversizing may cause significant issues in later stages of the PCB assembly process. The larger stencil apertures cause so-called balling or bridging. Those phenomena arise during solder application where film covers parts of PCB surface or even whole pathway between two neighbor holes. The result of both cases is an open electric circuit that leaves PCB completely unfunctional. After selecting the required stencil parameters, the metal sheet with specified composition and thickness is ordered from the metal factory, which inspects the sheet's thickness uniformity using x rays gauge and then ships it to our production plant.
What’s the difference between Printed circuit board vs PCB Assembly?
PCB is a printed circuit board because it is made by electronic printing, so it is called a “printed” circuit board. PCB is an important electronic component in the electronic industry, it is electronic base. It is the support of electronic components and the carrier of electrical connection of electronic components. PCB has been widely used in the production of electronic products.
PCB Assembly generally refers to a processing flow, which can also be understood as the finished circuit board, that is, PCBA can only be counted after the processes on the PCB are completed. PCB refers to an empty printed circuit board with no parts on it. The above is the difference between PCB and PCBA.
SMT (surface mounted technology) and DIP (Dual In-line Package) are both ways to integrate parts on the circuit board. The main difference is that SMT does not need to drill holes on PCB, but in dip, it needs to insert the pin into the drilled hole.
SMT mainly uses the mounting machine to mount some micro and small parts on the circuit board. Its production process is PCB positioning, solder paste printing, mounting by the mounting machine, reflow oven, and inspection.
The dip is a “plug-in”, that is to insert parts on the PCB board. It is a kind of plug-in integrated part when some parts are large in size and not suitable for mounting technology. Its main production processes are back glue, plug-in, inspection, wave soldering, plate brushing, and finished inspection.
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