Patch processing in the PCB empty board inspection, the top ten must use method


In the PCB industry, patch processing is an important part, and the PCB empty board for careful inspection work is particularly important. Reasonable inspection methods to ensure product quality,pcb making company and to avoid defective products into the market. In this article, we will introduce the methods of PCB inspection in chip processing to help readers better understand the importance of inspection and how to accurately carry out this work.

1. Visual inspection

Visual inspection is the simplest and most commonly used method. Through visual observation of the appearance of the PCB empty board, pads and other details,multilayer pcb you can initially determine whether there are obvious defects and problems. In visual inspection, special attention should be paid to the location and shape of the pads and the connection with the components.

2. X-ray inspection

X-ray inspection is a very delicate method, through the use of X-ray irradiation of the PCB empty board, you can observe the connection under the pads,PCB board china resistivity and other key parameters. x-ray inspection can detect hidden problems that can not be observed in the visual inspection, such as soldering inside the pads, short-circuiting between the pads, and so on.

3. Optical Microscopy

Optical microscope inspection is a commonly used method to observe the tiny details on the PCB through a magnifying lens. This method can help the inspector to find problems such as virtual welding on the pads, leakage of tin on the pads, etc. When using an optical microscope, pay attention to the angle and intensity of light to ensure the accuracy of observation.

4. High-speed resolution high-speed imaging system

High-speed resolution high-speed imaging system is a kind of advanced inspection equipment, through high-speed camera and image processing technology, it can carry out fast and accurate inspection of PCB empty board. The system can capture the instantaneous state of the pad to help inspectors find pad deformation, short circuit and other problems.

5. Electron microscope inspection

Electron microscope inspection is a high-resolution method to observe finer defects and problems by using an electron beam to irradiate the PCB empty board. Electron microscope inspection can be used to detect poor contact of pad connections, material quality, etc.

6. Infrared Thermography Inspection

Infrared thermography inspection is an inspection method using the principle of thermal radiation. By using infrared thermography to observe the thermal distribution of the PCB empty board, it can be used to find out the electrical connection problems between the pads, high temperature areas and so on.

7. Electrical test

Electrical test is a basic inspection method to test the electrical properties of PCB empty board by applying voltage, current and other signals. The electrical test can find the poor contact between pads and components, short circuit and other problems.

8. Insulation Resistance Test

Insulation resistance test is a method to check the insulation performance of PCB empty board, by applying a certain voltage to measure the resistance to assess the insulation status. Insulation resistance test can find out the insulation problem of PCB empty board, such as short circuit between conductive layer and insulation layer.

9. Environmental Adaptability Test

Environmental adaptability test is a method to test the PCB under different environmental conditions, by simulating different temperature, humidity and other environmental parameters to assess the stability and reliability of the PCB. Environmental adaptability test can find out the problems of the product under extreme environment, such as loose pads, broken pads, etc.

10. Functional Test

Functional test is a method to test whether the working function of PCB empty board is normal by simulating the real working scene. Function test can find the product in the actual use of the problem, such as signal interface failure, power consumption abnormalities.

To summarize, there are many different ways to check the PCB in SMD processing, and each method has its own advantages and applicable scenarios. In-depth and detailed inspection work can significantly improve product quality, ensure product reliability and stability. In practice, the need to choose the appropriate inspection method according to the specific circumstances, and combined with other auxiliary means of comprehensive inspection, in order to achieve the best inspection results.


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