The global flip chip market size is expected to reach USD 36.7 billion by 2028, rising at a CAGR of 8.2% during the forecast period. Growth of the market is attributed to growing demand for high connectivity devices, retaining high package density and increasing circuit durability.
Flip chip technology is currently undergoing a high growth owing to the advancement of copper pillar and micro bumping metallurgy and its extensive application in consumer electronic and mobile phones. Bumping methods support advanced manufacturing techniques, such that the flip chip process can be modified to meet new challenges. The increased performance capability of flip chip technology has become a commonly recognized high-range and medium-range technology. Rise in demand for computer, wireless mobiles, and consumer applications are driving the market for flip-chip technology. 2.5D IC and 3D IC packaging technology are trending these days. The consumer market holds major share of flip chip market. Demand for raw materials has increased by the manufacturers producing new technologies for bumping process. This leads to the aggressive growth in this business among the raw material market players. IT and other industries affiliated to is going through a significant change. Several industries prefer flip chips as these have higher efficiency over the traditional mechanism and lasts longer.
Market Trends, Drivers, Restraints, and Opportunities
- Rising bumping solutions are projected to boost the market during the forecast period.
- Rapid growth of consumer electronics is the major factor driving the market.
- High price of the product is anticipated to hamper the market growth.
- R&D investment and technological advancement in flip chip technology is estimated to create immense opportunities for the market players.
Market Segment Insights:
The copper pillar segment is anticipated to hold major market share
Based on types, the global flip chip technology market is fragmented as copper pillar solder bumping, tin-lead eutectic solder, lead-free solder, and gold bumping, other. Growth of the copper pillar segment is attributed to advancement of copper bumping metallurgy and its wide applications. .The copper pillar has effective pitch of 80 μm and appears to be a promising approach down to pitches of 40 μm. Copper pillar technology was patented by IBM in 2001, in the form of a metal post attached by solder to the silicon and substrate pads. This technology is currently used by mobile companies.
The IT & telecommunication segment is estimated to hold major market share during the forecast period
On the basis of applications, the global flip chip technology market is segregated into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace, and defense. These chips are used as the core part of the products. Flip chip has driven the above-mentioned industries over a period of time. It has gradually replaced wire bonding packaging, owing to their enhanced features such as compact size, rugged structure, improved efficiency, and high frequency application at low cost.
The market in Asia Pacific is projected to hold a major market share
In terms of regions, the global flip chip technologies market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Asia-Pacific accounts for a major market share of more than 35.8% of the total revenue. Presence of major players in countries such as India and China are expected to propel the regional market. Increasing demand for consumer electronics such as smartphones, tablets, and wearable electronics like smart watches and fitness bands is driving the market growth.
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